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KISS-103IL selective soldering machine including :

Standard Features : 
 SMEMA edge conveyor with program controlled width adjustment, positive PCB location and PCB flattening
 The direction of board movement is left to right unless otherwise specified
 ACE “Super Quick” Z-motion control for fastest processing times
 Windows 7 OS with the interactive SWAK-OS on machine programming interface rapid setup and time to “first production”, usually within 10 minutes
 Automated Fiducial Correction
 Board warp compensation
 Dual monitors (great for simultaneous video feed from cameras)
 Step and repeat capability in both X- and Y-axis for multiple boards in a panel
 “Lead free” alloy solder pot and pump assembly (KSPA-T)
 Full set of seven bullet nozzles (sizes ranging from 3mm up to 25mm)
 Nitrogen heat exchanger providing heated nitrogen to the solder nozzle
 Programmable solder wave flow rate
 Programmable solder pot timer
 Automated in process solder wave height check / adjust
 Automated solder pot level check and fill
 Two (2) process witness cameras
 Closed loop rotary encoders
 Automated spray fluxing system (KFS-SP)

 Absolute control over all critical process parameters:
- Solder temperature interlocked to within 2°C
- Height and travel speed of the solder wave
- Programmable initial preheat soak time
 Set-up kit containing all necessary support tools