SQ3000S™

Multi-Function 3D AOI, SPI & CMM

The SQ3000S™ is an advanced all-in-one inspection and metrology solution that combines AOI (Automated Optical Inspection), SPI (Solder Paste Inspection), and CMM (Coordinate Measuring Machine) in a single platform. Powered by revolutionary Multi-Reflection Suppression (MRS®) sensor technology, the SQ3000S achieves metrology-grade accuracy at full production speed, eliminating reflection-based distortions from shiny and specular surfaces.

With ultra-high resolution 3D imaging, AI² (Autonomous Image Interpretation) software, and the world’s first in-line CMM capability, the SQ3000S delivers unmatched inspection performance for SMT, semiconductor, microelectronics, and advanced packaging applications.

For larger assemblies, the SQ3000S-X supports board sizes up to 710 x 610 mm, enabling inspection of even the most demanding assemblies without compromising speed or accuracy.

Key Features & Benefits

• ✔ Multi-Function Integration – AOI, SPI, and CMM in a single platform, reducing equipment footprint.
• ✔ Fastest, high-accuracy 3D inspection with MRS® sensor technology.
• ✔ Metrology-grade precision with sub-10 μm resolution at production speed.
• ✔ AI² software for ultra-fast, simple programming (<13 minutes setup).
• ✔ Comprehensive defect coverage – missing, polarity, alignment, solder defects, coplanarity, engraving depth, and more.
• ✔ Nordson CMM suite – in-line coordinate measurement for coplanarity, true position, height, and critical dimensions.
• ✔ Nordson Sight SPC software – complete machine-to-factory level statistical process control and traceability.
• ✔ Large board capability – up to 710 x 610 mm with SQ3000S-X.
• ✔ User-friendly interface with multi-touch control and 3D visualization tools.

Specifications (SQ3000S Series)